Taiwan Semiconductor(TSC), a global supplier of discrete power electronics devices, LED drivers, analog ICs and ESD protection devices, announces an additional 200V Ultra fast diode to the family of ThinDPAK devices.
KEY BENEFITS:
- Low profile (1.3mm height) ThinDPAK package
- Ultra fast (trr ＜ 25ns) reduces switching losses and improves efficiency
- Footprint compatible with traditional DPAK package with 44% low profile to increase power density
- Heatsink area is 20% larger than traditional DPAK package to reduce the thermal resistance
- Operating temperature range from -55°C to 175°C
- Automotive and Industrial grade available
APPLICATIONS:
- High frequency switching
- DC/DC converters
Product Portfolio
| Technology | Part Number | VRRM(V) | IF(A) | VF(V) | IR(µA) | Trr(ns) | TJ(°C) | Config. |
| UF Planar | PUAD4D(H) | 200 | 4 | 0.92 | 2 | 25 | 175 | Single |
| UF Planar | PUAD8D(H) | 200 | 4 | 1.0 | 2 | 25 | 175 | Single |
| UF Planar | PUAD6DC(H) | 200 | 2*3 | 0.95 | 2 | 25 | 175 | Common Cathode |
| UF Planar | PUAD8DC(H) | 200 | 2*4 | 0.92 | 2 | 25 | 175 | Common Cathode |
| UF Planar | PUAD10D(H) | 200 | 2*5 | 0.95 | 2 | 25 | 175 | Common Cathode |
* Adding “H” inthe tail of Part Number are Automotive grade.
Newsletter_1_2023_200V_ThinDPAK